The semiconductor equipment and materials industry is urgently pursuing a range of alternative microelectronics manufacturing technologies.
Innovation in device architecture and process technology is a critical priority for the semiconductor manufacturing industry in light of the complexity, cost and uncertain timing of availability for the introduction of 450mm wafers and next-generation lithography.
Consequently, the semiconductor equipment and materials industry is urgently pursuing a range of alternative microelectronics manufacturing technologies including finFETs, 3D-IC, and multiple patterning lithography.
These and other wafer processing innovations to maintain the pace of Moore’s Law will be highlighted at SEMICON West 2014 to be held from tomorrow (July 8-10, 2014) at the Moscone Center in San Francisco.
There twelve sessions will address the key issues in wafer processing – including roadblocks and breakthroughs – surrounding the development and adoption of new technologies in wafer processing including: New Device Architectures, EUV Technologies, Advanced Lithography, Nano Defect Detection and Metrology, and Atomic Layer Deposition (ALD); and Advanced Components and Subsystems.
Will Semicon West create a great knowledge sharing platform this year?